The Model 7072 semiconductor matrix card is specifically designed for low level, high impedance measurements that occur during semiconductor parameter tests on wafers and devices. This unique design offers two low current circuits with a specified maximum offset current of 1 pA for a sensitive resolution of the sub-picoamp measurement and two CV paths for the measurement of the capacitance voltage characteristics from DC to 1 MHz. Four additional high-quality signal paths with an offset current of <20 pA enable universal signal switching to 100 nA or 200 V. The connections are 3-pin, the outer shell being connected to the chassis for safety and noise protection reasons. The center conductor is completely surrounded by the inner conductive shield so that fully protected measurements can be taken to achieve higher insulation and improve measurement speed and accuracy. Isolation relays on the low-current and CV paths automatically disconnect unused circuits for minimal interference and peak performance. With the 707A or 708A mainframe, each line (signal path) can be programmed for break-before-make or make-before-break operation. For applications that require connections to a large number of devices or test points, the 7072 matrix can be expanded with additional cards. The low-current and CV series can be expanded to other cards with coaxial jumpers.