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NI 868171-01 | Ethernet cDAQ Thermal Test Starter Bundle

Manufacturer number: 868171-01

868171-01
868171-01
868171-01
868171-01
868171-01
868171-01
868171-01
868171-01
868171-01
868171-01
Delivery time upon request

CHF 5,450.00

plus VAT. CHF 5,891.45 VAT plus shipping costs

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Highlights Documents / Downloads Description Related Articles

NI 868171-01 | Ethernet cDAQ Starter Bundle for temperature tests.

Documents & Downloads

Brochure
pdf | 1.24 MB
Datasheet
pdf | 0.79 MB

Description

868171-01 | Ethernet cDAQ Thermal Test Starter Bundle

The Ethernet cDAQ bundle 868171-01 for temperature testing is a flexible and powerful solution for thermal chamber and board-level temperature testing in research, development and quality assurance. Combining an Ethernet-enabled 8-slot chassis and high-resolution thermocouple input modules, the bundle enables easy setup, fast logging and high-precision temperature monitoring. Thanks to its network capability, the system is ideal for remote testing or distributed measurement applications.

The bundle consists of:

  • Chassis: NI cDAQ-9189 - 8-slot Ethernet chassis for distributed measurements.
  • Modules: 2x NI 9213 - Thermocouple input modules with 16 channels and 24-bit resolution for precise temperature measurements.
  • Accessories: 2x NI 9940 - Backshell for spring clamp connections for secure and robust connection.

Product features:

  • High-precision measurements with 24-bit resolution for accurate temperature measurement.
  • Fast synchronization: High-quality data is synchronized within 40 ns via Ethernet.
  • Easy setup through shared cables for data transmission and synchronization, reducing cabling effort.
  • Flexibility through network operation, enabling remote measurements and distributed testing.
  • Expandability through an 8-slot chassis that can be adapted to future measurement requirements.

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About the Manufacturer

NI
NI
National Instruments is a global leader in test, measurement, and control solutions. NI's platform-based approach combines modular hardware and software to help customers address complex engineering challenges. Applications range from automotive, electronics, and energy to research/education and industrial systems.
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