NI 868172-01 | Ethernet cDAQ Structural Test Starter Bundle

Manufacturer number: 868172-01

NI 868172-01 | Ethernet cDAQ Starter Bundle for structural tests.

Description

868172-01 | Ethernet cDAQ Structural Test Starter Bundle

The Ethernet cDAQ Bundle 868172-01 for structural testing has been specially developed for advanced structural and load analyses. With a robust Ethernet-enabled chassis and high-precision bridge-connected measurement modules, this system provides a reliable solution for monitoring structures, mechanical components and deformation analysis. The network capability enables easy setup and fast synchronization, allowing distributed or remote testing to be performed efficiently.

The bundle consists of:

  • Chassis: NI cDAQ-9189 - 8-slot Ethernet chassis, optimized for distributed measurements.
  • Modules: 2x NI 9237 - 4-channel measurement modules for bridge circuits, with a sampling rate of 50 kS/s per channel for high-precision strain measurements.
  • Accessories: 2x NI 9923 - front-mount connection blocks for 37-pin D-Sub connectors that enable reliable connection of the measurement signals.

Product features:

  • Designed for structural and stress tests with precise data acquisition.
  • High-resolution synchronization: data acquisition within 40 ns via Ethernet for highest accuracy.
  • Easy setup with shared cables for data transmission and synchronization, reducing cabling effort.
  • Network operation for distributed or remote testing.
  • Expandable system with an 8-slot chassis to adapt to growing requirements.

Application areas:

  • Structural health monitoring of bridges and buildings to assess integrity and performance.
  • Stress testing of mechanical components under realistic operating conditions.
  • Strain and deformation analysis for stress testing and material testing.

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About the Manufacturer

NI
National Instruments is a global leader in test, measurement, and control solutions. NI's platform-based approach combines modular hardware and software to help customers address complex engineering challenges. Applications range from automotive, electronics, and energy to research/education and industrial systems.

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